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Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® (The International Series in Engineering and Computer Science)
Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® (The International Series in Engineering and Computer Science)

Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® (The International Series in Engineering and Computer Science)

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Manufacturer: Springer
Author: Erdogan Madenci
Binding: Hardcover
Publication Date: 2002-12-31
Publisher: Springer
Label: Springer
Number Of Pages: 208
Features:
Editorial Review:
Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS® that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS® to perform solder joint reliability analysis. Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages.
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Customer Reviews
Average Customer Rating: 5.0

The essential guide for solder reliability analysis with ANSYS 2006-09-14
This text is a gem. The included add-on package for ANSYS alone is worth twice the price of this book. The reader is first introduced to the theoretical basis of fatigue life prediction, a rather thorough survey of research done in the electronic packaging field. The chapters that follow explain step by step how a detailed FEA model can be created very efficiently using the provided addon package called ReliANS. Highly recommended for any engineer wanting to exploit ANSYS for more reliable package design, and others who wish to improve on their current methods.


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